Process Engineer – Plasma Etch

About the role

As a Process Engineer you will design, develop and optimise plasma etch processes for advanced semiconductor and display applications. You will work closely with customers, R&D, manufacturing and engineering teams to drive performance and resolve technical challenges.

Key responsibilities

• Develop and optimise plasma etch processes for next‑generation semiconductor devices.
• Design and execute experiments, analyse data and implement data‑driven process improvements.
• Investigate and resolve process‑ and chamber‑related issues using structured root‑cause analysis.
• Support customer escalations and provide technical solutions to manufacturing challenges.
• Characterise process‑chamber interactions and evaluate hardware performance.

Required profile

• Bachelor's or Master's degree in Engineering, Materials Science, Physics or related field.
• 4‑7 years of industry experience (or 2‑5 years with a Master's) in semiconductor fab etch process engineering.
• Strong analytical, problem‑solving and communication skills.

Required skills

• Hands‑on experience with Applied Materials etch platforms (Producer®, DPS®, Centris®, Sym3®, Sym3 Y®, Sym3 Z®).
• Design of Experiments (DOE) and statistical analysis tools (JMP or equivalent).
• Characterisation techniques: TEM, SEM, EDS.
• Chamber troubleshooting and process qualification.

What we offer

• Salary range $124,000 – $171,000 per year.
• Full‑time, onsite position with up to 10% travel.
• Comprehensive benefits, bonus and stock award programs.
• Opportunities for continuous learning and innovation in a global leader.