Panel Packaging Technology Enablement Director

About the role

Applied Materials is seeking a Director to lead the development and validation of panel‑level packaging technologies that enable AI accelerators and high‑performance computing. The role combines technical leadership, customer engagement, and management of a multidisciplinary engineering team.

Key responsibilities

• Define and execute the panel technology enablement roadmap, translating AI package requirements into process and integration targets.
• Lead complex integration programs from concept through customer transfer, using DOE and statistical methods to establish process windows.
• Engage with strategic customers, substrate manufacturers, OSATs and foundries to position Applied technologies and negotiate specifications.
• Build and manage partnerships with materials suppliers, equipment partners, research institutes and universities to close ecosystem gaps.
• Recruit, develop and mentor a multidisciplinary team, set priorities, manage resources and align output with business objectives.

Required profile

• Ph.D. in a relevant field with 12+ years (or M.S. with 15+ years) experience in semiconductor packaging, substrate or interconnect technology development.
• Proven record of leading engineering teams and delivering complex technology programs to high‑volume manufacturing.
• Experience presenting to and negotiating with senior customer and partner leadership.
• Track record of patents, publications and conference presentations.

Required skills

• Advanced packaging integration (2.5D/3D, fan‑out, build‑up processing).
• Process knowledge: PVD, plating, etch, lithography, dielectric processes.
• Design of Experiments (DOE) and statistical analysis.
• Panel‑format processing, glass core substrates, through‑glass vias, fine‑line RDL (<5 µm line/space).
• Familiarity with AI accelerator and HPC package architectures.