Principal Applications Engineer - SerDes Networking Solutions

About the role

NXP's SerDes Networking Solution (SNS) team delivers open-standard Automotive SerDes Alliance (ASA) Motion Link multi-Gigabit connectivity for next-generation sensors and vehicle displays. As part of the Applications Engineering team, you will work with internal engineering teams to develop collaterals that help customers adopt SerDes solutions, and with field teams and customer engineering teams to ensure successful system design and bring-up. Locations available: San Diego and San Jose, California or Austin, Texas.

Key responsibilities

• Collaborate with IC design, systems, firmware and test teams to turn field issues and customer requirements into product improvements and new features.
• Review customer schematics and layouts for signal-integrity and power-integrity best practices (impedance control, terminations, return paths, via design, reference plane strategy).
• Lead board-level bring-up and validation using oscilloscopes and protocol analyzers, and generate test reports and recommendations.
• Provide on-site or remote debug support for complex customer issues.
• Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes and training materials.
• Participate in trade shows and provide FAE training.

Required profile

• Bachelor's degree or above in Electrical/Electronic Engineering or a related field.
• Extensive experience (12+ years) in hardware design, applications engineering or system validation.
• Experience working with global, cross-functional teams (design, systems, test, marketing, field).

Required skills

• Familiarity with high-speed protocols such as Ethernet networking and switching, MIPI CSI-2, and DP/eDP.
• Understanding of high-speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization and clocking.
• Demonstrated experience with multi-Gbps serial links (Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes).
• Proficiency with SI/PI tools and simulations (S-parameter analysis, eye/jitter simulations) and interpretation of simulation vs. measurement correlation.
• Hands-on use of oscilloscopes, TDR, VNA, BERT, protocol analyzers and logic analyzers.
• PCB design for high speed: layer stack-up, routing constraints, differential pairs, reference planes, decoupling and power delivery.