Chip Lead - Automotive SoC & Data Center

About the role

NXP's AI & Chip Engineering team defines and develops System on Chip, ASICs, digital and analog IP for products such as automotive microprocessors, application processors and data center processors. This Chip Lead position leads product execution for automotive ASIL-B/D SoCs and data center SoCs, acting as the central design point of contact for all cross-functional teams involved in the part. The role is based in Austin and is hybrid, with a few days in the office each week.

Key responsibilities

• Define the part with Systems, Marketing, PE/TE and architecture engineering, and generate and analyze data to choose the right and cost-effective architecture
• Work with IP, technology and packaging partners to select the right IP, packages and technology options
• Resolve handoff and integration challenges across IP and SoC functions (frontend, verification, AMS, DFT, emulation, validation, physical implementation)
• Oversee definition management so implementation complies with requirements, and support downstream teams on post-silicon activities
• Enable productization with Test and Product engineering, and support post-silicon evaluation teams (functional and analog validation, characterization, application and software)
• Manage workload and resources, create predictable project plans, and work with the program management office to track dependencies
• Mentor engineers across functions and lead teams in a matrix organization under resource and schedule constraints

Required profile

• Bachelor's degree in Engineering with at least 15 years of design development experience, including at least 5 years leading complete designs and design functions
• MS in Electrical Engineering preferred (higher-level education may substitute for some experience)
• Experience leading global cross-functional teams
• Experience leading designs in smaller geometries desired