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Senior IC Packaging Designer

Falcomm · Atlanta

New
Senior 🇬🇧 English
Cadence Allegro APD/SiP Mentor Xpedition HFSS Q3D PowerSI CAM350 Valor Calibre Ansys Electronics Desktop Icepak Python TCL Perl Shell

Job description

About the role

Falcomm develops high-performance, energy-efficient RF power amplifier technologies and is looking for a Senior IC Packaging Designer in Atlanta, GA. The role designs and optimizes package architectures for RF integrated circuits, supporting high-frequency performance, thermal efficiency and manufacturability, and works closely with RFIC designers, layout engineers, testing teams and manufacturing partners.

Key responsibilities

  • Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic or leadframe-based packages.
  • Create package layouts, bond diagrams and substrate routing using semiconductor packaging EDA tools.
  • Work with signal integrity, EM and thermal simulation teams to validate package performance.
  • Generate package documentation, fabrication drawings and assembly specifications.
  • Take part in design reviews, prototype builds and failure analysis to improve RF performance and yield.
  • Co-optimize chip and package performance with RFIC designers, minimizing parasitics and signal loss.
  • Support package integration with PCB design teams and coordinate with fabrication and assembly partners.

Required profile

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or a related discipline.
  • 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (wirebond, flip-chip, PoP or SiP).
  • Strong foundation in electrical, thermal, materials or mechanical engineering principles relevant to IC packaging.
  • Full-time, onsite work in Atlanta, GA.

Required skills

  • Cadence Allegro APD/SiP or Mentor Xpedition for package design.
  • Preferred: signal and power integrity tools (HFSS, Q3D, PowerSI) and knowledge of DDR or PCIe interfaces.
  • Preferred: CAM350, Valor or Calibre, and 3-D modeling in Ansys Electronics Desktop with EM simulation in HFSS and thermal simulation in Icepak.
  • Preferred: scripting or automation (Python, TCL, Perl or shell) and RFIC or 5G packaging experience.

What we offer

  • Competitive salary and equity package.
  • Health, dental and vision insurance.
  • 401(k) retirement plan.
  • Paid time off and sick leave.

Questions fréquentes

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Source : ats:workable

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Published 2 days ago

Expires 1 month from now

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Falcomm

Atlanta