RFIC Thermal Engineer

About the role

Falcomm develops high-performance, energy-efficient RF power amplifier technologies and is looking for an RFIC Thermal Engineer in Atlanta, GA. The role analyzes, models and optimizes thermal performance in RF integrated circuits and semiconductor packages, covering heat dissipation, thermal reliability and thermal management for high-power RF devices. It works closely with RFIC designers, packaging engineers and system teams.

Key responsibilities

• Develop thermal models for RFIC devices, packages and modules to evaluate heat dissipation and temperature distribution.
• Perform thermal simulations and analysis to support design optimization and reliability improvements.
• Collaborate with RFIC design and packaging teams to develop thermal management strategies.
• Evaluate thermal performance across different packaging technologies and materials.
• Support silicon validation and characterization related to thermal performance.
• Analyze thermal failure mechanisms and recommend design or process improvements.
• Document analysis methods, results and recommendations.

Required profile

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or a related discipline.
• 3-5 years of experience with thermal analysis, modeling or simulation in semiconductor or electronic systems.
• Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs.
• Willingness to work full-time, onsite in Atlanta, GA.

Preferred skills

• Experience with thermal simulation tools such as ANSYS, COMSOL or similar platforms.
• Familiarity with semiconductor packaging technologies and thermal interface materials.
• Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs.

What we offer

• Competitive salary and equity package.
• Health, dental and vision insurance.
• 401(k) retirement plan.
• Paid time off and sick leave.