Process Integration Engineer III

About the role

Applied Materials is seeking a Process Integration Engineer III to design and optimize manufacturing processes for display and semiconductor technologies. The role involves data collection, hardware characterization, troubleshooting, and collaboration with R&D, vendors, and customers.

Key responsibilities

• Create process, module, and device integration solutions for photonic, quantum, and 3D integration platforms.
• Develop advanced packaging, materials, and metrology approaches for quantum devices.
• Design experiments, collect and analyze data, and compile technical reports.
• Troubleshoot complex engineering issues and perform root‑cause analysis.
• Generate internal and external documentation, presentations, and technical reports.

Required profile

• Demonstrated expertise in semiconductor process integration and 3D integration.
• Strong problem‑solving skills with ability to lead small projects.
• Ability to collaborate with customers, start‑ups, and academic partners.
• Knowledge of best practices and market differentiation in advanced packaging.

Required skills

• Semiconductor process integration
• 3D integration techniques
• Advanced packaging development
• Metrology and hardware characterization

What we offer

• Salary range $108,000 – $148,500 per year.
• Supportive work culture with health, wellbeing, and professional growth programs.
• Opportunities to work on cutting‑edge quantum and photonic technologies.