Account Manager – High Speed Interconnect

About the role

As a Global Account Manager for High Speed Interconnect, you will own end‑to‑end responsibility for strategic hyperscale and silicon design customers in the Bay Area, driving growth across optical and copper interconnect, thermal, acoustic and material science solutions.

Key responsibilities

• Own global account strategy, revenue growth, pipeline, forecasting and executive relationships for assigned customers.
• Lead design‑in and commercialization of EBO, TwinAx, thermal, acoustic and material science solutions from early engineering engagement through qualification, negotiation, launch and scale.
• Build multi‑year account plans that align customer technology roadmaps with 3M capabilities and new growth opportunities.
• Coordinate global teams across sales, application engineering, R&D, supply chain, manufacturing and leadership to deliver customer commitments.
• Lead complex commercial negotiations and strategic agreements that balance customer value, growth, margin, capacity and long‑term partnership objectives.
• Serve as a trusted advisor to customer engineering, sourcing and executive stakeholders while aligning connector, cable, package and manufacturing partners for adoption and scale.

Required profile

• Bachelor’s degree or higher.
• Minimum five years of sales, account management, business development or field application engineering experience.
• Current, valid driver’s license.
• Seven or more years of experience in data center, cloud infrastructure, semiconductors, interconnect, electronics, thermal management or advanced materials.
• Direct experience supporting hyperscale, silicon design, networking, optics or AI infrastructure customers.
• Proven track record of growing strategic accounts, securing design wins and leading complex negotiations.
• Strong technical aptitude, executive communication skills and ability to translate customer requirements into cross‑functional priorities.

Required skills

• Data center technologies
• Cloud infrastructure
• Semiconductors
• Interconnect (optical and copper)
• Electronics
• Thermal management
• Advanced materials
• Optics
• AI infrastructure