Jobiglo

No results.

Technical Director – Key Logic Account (Global Field Group)

amat · Hillsboro

Onsite Senior 176,000 - 242,000 USD/year 🇬🇧 English
deposition etch anneal metrology process integration advanced packaging semiconductor capital equipment

Job description

About the role

As Technical Director for a key logic account, you will be a senior technical leader working directly with customers to identify high‑impact yield, performance and cost challenges, develop multi‑product technology programs, and feed insights back into Applied Materials’ product roadmaps.

Key responsibilities

  • Lead account‑wide strategic initiatives to improve device yield, performance and cost across deposition, etch, anneal and metrology product areas.
  • Interface with customers at development and high‑volume manufacturing sites to evaluate new technologies and build strategic partnerships.
  • Identify technology inflection points through customer engagement and communicate them to internal product and engineering teams.
  • Align internal commercial, technical and operations groups, drive consensus and manage timelines, milestones, risks and deliverables.
  • Act as the senior technical authority for the account, supporting internal teams on deep technical issues and mentoring engineers.

Required profile

  • B.S. in an engineering discipline; M.S. in Physics, Chemistry or related STEM field preferred; advanced degree (M.S. or Ph.D.) a plus.
  • 12+ years experience in wafer fab or semiconductor capital equipment; 15+ years preferred in process engineering, integration or technology development.
  • Proven track record leading complex, cross‑functional technical programs and influencing outcomes across engineering, commercial and operations teams.
  • Extensive experience partnering with customers at development and high‑volume sites, presenting to senior technical and executive stakeholders.

Required skills

  • Process engineering for semiconductor technologies (deposition, etch, anneal, metrology).
  • Process integration of leading‑logic or advanced‑packaging flows.
  • Ability to bundle value across multiple process technologies to solve device‑level yield, performance or cost problems.
  • Strong communication and influencing skills across organizational boundaries.

What we offer

  • Salary range $176,000 – $242,000 per year.
  • On‑site location in Hillsboro, OR with less than 20 % travel.
  • Supportive work culture, professional development opportunities and comprehensive benefits.

Questions fréquentes

Le salaire proposé pour ce poste est de 176-242k USD par an. Le détail figure dans l'annonce.
Cliquez sur "Postuler maintenant" en haut de la page. Vous pouvez importer votre CV en 1 clic — Jobiglo extrait automatiquement vos informations et postule pour vous.
Source : ats:workday

Why are you reporting this job?

Thank you for your report. We will review this job.

Apply in 30 seconds

Enter your email to apply. An account will be created automatically.

Apply now →

By continuing, you accept our terms of use.

Already have an account? Login

A question about this job?

Ask it here: you will get the full job summary by e-mail, right away.

💬 Chat with us on Telegram

Published 1 week ago

Expires 1 month from now

4 views · 0 interested

Boost your chances

Upload your CV — we will match you with relevant openings.

Analyzing your CV...

amat

Hillsboro