Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software (Advanced Packaging)

About the role

KLA, a global leader in electronics for the semiconductor manufacturing ecosystem, is looking for a highly strategic and technically savvy Sr. Technical Solutions Manager to drive the go-to-market strategy, positioning and growth of its Process Control and Yield Enhancement Software solutions for Advanced Packaging. The role sits at the intersection of product management, engineering, sales and customer engagement, and helps define how KLA delivers value to semiconductor manufacturers adopting advanced packaging technologies.

Key responsibilities

• Develop and execute product marketing strategies and analyze market trends, competition and emerging technologies such as 2.5D/3D packaging, chiplets and heterogeneous integration
• Define value propositions, messaging and product differentiation, create sales enablement materials and partner with corporate marketing on product launches
• Build relationships with semiconductor manufacturers, OSATs, foundries and IDMs, gather Voice of Customer insights and represent KLA at industry events
• Work with Product Management, R&D, Applications Engineering and Sales to influence roadmap decisions and support pricing, forecasting and lifecycle management
• Equip global sales teams with tools, training and battle cards, and monitor adoption metrics

Required profile

• Bachelor's degree in Engineering, Computer Science, Physics, Materials Science, Semiconductor Manufacturing, Business or a related field
• 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering or process control
• Experience marketing or supporting software products, analytics platforms, manufacturing solutions or semiconductor equipment technologies
• Preferred: Master's degree or PhD, MBA, or direct experience with advanced packaging technologies (chiplets, TSV, hybrid bonding, HBM)

Required skills

• Strong understanding of semiconductor manufacturing, yield management, process control and advanced packaging
• Excellent communication, presentation and executive storytelling skills
• Ability to influence without direct authority and engage senior customer executives

What we offer

• Base pay range of $138,500 to $235,500
• Possible performance incentives and benefits such as medical, dental, vision, life insurance, 401(k) with company matching, ESPP, tuition reimbursement, EAP, paid time off and family care leave