Photolithography Equipment Engineer

About the role

NXP's Front End Operations is looking for a Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. The role sits within the Front End Operations business line, which ensures manufacturing excellence and delivers high-quality, scalable and cost-competitive semiconductor devices. Prior experience with semiconductor manufacturing processes is required.

Key responsibilities

• Identify and reduce recurring machine faults and create hard-down action plans driven to root cause.
• Develop and improve tool maintenance procedures and train maintenance technicians.
• Reduce the overall cost of equipment and scrap, and improve tool utilization and availability.
• Participate in and/or lead cross-functional and lean activity teams, and support process development activities.
• Sourcing and releasing new equipment.
• Work closely with the photo process team to identify and reduce sources of process variation and implement a zero-defect process.

Required profile

• BS or MS degree in engineering or a related field.
• More than 5 years of process engineering experience in a similar high-volume semiconductor manufacturing environment.
• Prior experience with semiconductor manufacturing processes is required.

Required skills

• Previous equipment experience with ASML Scanner PAS5500/400/700 scanners is required.
• Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs and Onto IRIS is desirable.
• Knowledge of Six Sigma root cause problem solving, SPC, 8D and FMEAs.