IC Package Engineer

About the role

Etched builds AI chips tailored to specific model architectures, and is looking for an experienced IC Package Design Engineer to own substrate layout and package design. The role focuses on advanced packaging technologies such as CoWoS and large-scale BGA designs, and on the mechanical and electrical integrity of packages for next-generation AI hardware. The team is fully in-person in Cupertino.

Key responsibilities

• Own the end-to-end package design process, including substrate layout and IC package design, working with internal teams and external vendors to deliver manufacturable solutions.
• Use CoWoS and heterogeneous integration techniques to design open and closed packages, adding stiffeners where needed.
• Design large-scale BGA packages (over 4000 balls), optimizing ball pitch, routing and power/ground planes.
• Run mechanical and warpage analysis to meet coplanarity requirements, collaborating with mechanical teams on simulation and testing.
• Validate package layouts against electrical and mechanical constraints, give design reviews and archive DFM learnings.
• Work with chip design, thermal, mechanical and manufacturing teams, and interface with vendors on design requirements and production feasibility.
• Oversee package reliability testing (thermal, warpage, shock, shear, HTSL, HAST, ALT, JESD22, electrical).

Required profile

• Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering or a related field.
• 5+ years of experience in advanced IC package design, including CoWoS or equivalent.
• Proven experience in substrate layout and BGA design for large ball arrays (>4000 balls) with >20 GHz signaling and >500 W.
• Understanding of stiffener design, open vs. closed packages, and warpage and coplanarity issues.
• Experience with advanced packaging nodes (e.g. 2.5D/3D stacking) and thermal management in packages.
• Previous experience in AI, HPC or semiconductor design companies.

Required skills

• Cadence APD/SIP, Mentor Xpedition or similar package design tools.
• Mechanical stress analysis, simulation and validation methods.
• Communication across multi-disciplinary teams and external partners.

What we offer

• Medical, dental and vision coverage, with premiums paid in full and 90% for dependents.
• Housing subsidy of $2,000 per month for those living within walking distance of the office.
• Daily lunch and dinner provided in the office.
• Relocation support for people moving to Cupertino.