Field Applications Engineer (FAE) Intern - Summer 2027

About the role

NXP is looking for a technically curious engineering student to join its Field Applications team as a paid, 12-week summer internship in Summer 2027. Interns are embedded in the Field Application Engineering organization, paired with an experienced FAE mentor and given meaningful technical work from day one. The program is a main pipeline into NXP's Technical Sales & Applications Program (TSAP), and strong performers may receive a return offer after graduation.

Key responsibilities

• Work with FAEs to understand customer needs and recommend NXP MCU, MPU, connectivity, analog, power-management and edge-processing solutions.
• Support customer meetings, design reviews, product evaluations, proof-of-concept activities and solution demonstrations.
• Bring up evaluation boards and reference designs, configure SDKs and development environments, and integrate example software into prototypes.
• Develop or modify firmware and application code in C, C++, Python or similar, and support debugging of real-time control, sensor, connectivity, Linux or RTOS applications.
• Run product evaluation and lab validation with oscilloscopes, logic analyzers, multimeters, power supplies and probe tools, and assist with schematic and PCB reviews.
• Create test plans, capture measurements and present findings in a final capstone presentation to sales and applications leadership.
• Prepare customer-ready presentations, quick-start guides, application notes and training material, and give feedback to sales, marketing and product teams.

Required profile

• Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics or a related field.
• Rising junior, senior or graduate student, graduating between December 2027 and June 2029.
• Cumulative GPA of 3.0/4.0 or higher.
• Authorization to work in the United States; no sponsorship available for intern roles.
• Availability for 12 weeks full time during Summer 2027 (May-August).

Required skills

• Preferred: coursework or projects in embedded systems, microcontrollers, FPGA, wireless communications, power electronics, control systems or semiconductor applications.
• Preferred: hands-on experience with microcontrollers, MPUs, FPGAs, development boards and reference designs; ARM-based systems a plus.
• Preferred: programming in C, C++ or Python, with exposure to SDKs, version control, RTOS basics or embedded Linux.
• Preferred: familiarity with UART, SPI, I2C, CAN, USB or Ethernet.

What we offer

• Competitive paid hourly compensation.
• Dedicated FAE/TSE mentor and day-to-day manager support.
• Hands-on exposure to the semiconductor applications cycle, from requirements to design-in support.
• Cohort events, workshops, executive speaker sessions and networking opportunities.
• Structured learning on NXP product portfolios and embedded systems.
• Possible relocation support or housing stipend depending on location.
• Possibility of a return full-time offer into the TSAP program upon graduation.

Applications are submitted through NXP's careers portal and reviewed on a rolling basis; early application is strongly encouraged. Preferred locations include Austin, Detroit and San Jose, with some local customer travel expected.