Field Application Engineer, Entry Level (TSAP)

About the role

NXP's Technical Sales & Applications Program (TSAP) is an early-career development program for recent college graduates seeking customer-facing technical roles in the Industrial, IoT and Automotive markets. It combines structured learning with on-the-job experience and leads to a permanent Field Application Engineer (FAE) position in the Americas Sales organization, with placement based on business needs and candidate preferences. The FAE gives customers technical guidance on NXP solutions and hands-on support, specializing in a critical technology area such as microcontrollers, applications processors, wireless, security or security.

Key responsibilities

• Provide technical leadership to sales teams and customers on the NXP portfolio, for example MCU/MPU selection, bring-up and software stack integration.
• Lead proof of concept development, product evaluations, debug activities, integration efforts, lab validation and basic system-level troubleshooting with oscilloscopes, probes, power analyzers and debug tools.
• Design support through schematic and PCB reviews.
• Prepare and deliver technical presentations, demonstrations and training materials with guidance from senior engineers.
• Work with sales, marketing, product management and engineering teams to communicate customer needs and support business opportunities.
• Drive enablement by sharing customer feedback, identifying gaps in collateral and improving tools, software and documentation.
• Represent NXP at customer meetings, workshops, partner and industry activities.

Required profile

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics or a related field, graduated in the past 24 months or an upcoming graduate.
• Minimum GPA of 3.0 or higher.
• Experience presenting technical work through class projects, internships, research, competitions or student organizations.
• Demonstrated leadership, teamwork or campus involvement through engineering teams, competitions or technical societies.
• Internship, co-op or project experience in applications engineering, design engineering, embedded software, technical sales or customer support.
• Willingness to relocate to Austin and travel primarily within North America.

Required skills

• Foundational understanding of analog and digital circuits, embedded systems, microcontrollers, processors and semiconductor applications.
• Software development skills in C, C++, Python or similar languages.
• Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards and common lab tools.
• Strong problem-solving, analytical, written and verbal communication skills.

Nice to have: ARM-based embedded systems, RTOS basics, Linux embedded development, embedded communication interfaces (UART, SPI, I2C, CAN, USB, Ethernet), real-time control or motor-control concepts, edge AI awareness, and embedded security, safety and reliability concepts.