Packaging Engineer (Junior/Senior) – Optoelectronic Integration

About the role

Elevate Quantum is seeking a Jr./Sr. Packaging Engineer to lead the development of optoelectronic packaging and integration processes for quantum and advanced photonics applications. Reporting to the Director of Packaging, you will work in a fast‑paced, team‑oriented environment to qualify new processes and support their launch.

Key responsibilities

• Plan and execute experiments for new electronic and photonic packaging processes, including flip‑chip bonding, wire‑bonding, reflow, and fiber‑to‑chip optical coupling.
• Utilize metrology tools, reliability tests, FMEA and root‑cause analysis to optimize assembly processes.
• Compile and analyze data, write technical reports, and present results to stakeholders.
• Support process launch, train manufacturing personnel, and troubleshoot technical issues in production.
• Develop novel optical packaging solutions and maintain existing equipment and vendor relationships.

Required profile

• M.S. or Ph.D. in Physics, Materials Science, Mechanical, Electrical, Optical Engineering, Chemistry or related field.
• 3–7 years of experience with photonic systems, electronic packaging, solder and reflow processes in high‑tech industries (quantum, MEMS, semiconductor, PCB).
• Hands‑on experience with fiber alignment, flip‑chip bonders, wire bonders, reflow ovens, and relevant metrology equipment.
• Strong problem‑solving, written and verbal communication skills, and ability to work independently in a fast‑paced environment.

Required skills

• Flip‑chip bonding, wire‑bonding, solder attach, fiber‑to‑chip coupling.
• Metrology and reliability testing, FMEA, root‑cause analysis.
• Profilometry, XPS, XRD, EDX for thin‑film characterization.
• Statistical analysis and data mining using JMP and Excel.
• Optical, RF and electrical testing of R&D devices.