Dry Etch Process Engineer – Semiconductor Manufacturing

About the role

Join Tower Semiconductor’s high‑volume manufacturing team to sustain, improve, and develop dry etch processes for advanced semiconductor devices. You will collaborate with operations, equipment engineering, integration, and R&D to deliver products that meet customer specifications.

Key responsibilities

• Sustain and improve dry etch processes in a high‑volume fab environment.
• Develop new dry etch capabilities and process enhancements to boost yield, throughput, and cycle time.
• Ramp new process technologies from R&D to volume production.
• Characterize and qualify new equipment, upgrades, chemicals, and process technologies.
• Troubleshoot yield issues and support technology transfers between global sites.
• Lead task forces and apply FMEA, lean, Six Sigma, and 8D problem‑solving methods.

Required profile

• B.S. in Chemistry, Chemical Engineering, Materials Science, Solid‑State Physics, Electrical Engineering or related field.
• 3‑5 years of hands‑on dry etch process engineering experience in production.
• Proven ability to analyze wafer/lot data using statistical methods and DOE.
• Strong organizational and communication skills with the ability to work independently.

Required skills

• Expertise with TEL Unity, AMAT DPS, MXP, LAM2300, 9400, 9600 etch tools.
• Statistical design of experiments (DOE) and data analysis (JMP, probability plots, t‑tests).
• FMEA, lean manufacturing, Six Sigma, 8D problem‑solving.
• Experience with PROMIS WIP management software.

What we offer

• Competitive salary range $78,850‑145,122 per year.
• Opportunity to work on cutting‑edge semiconductor technologies in a global leader.