SoC Power and Thermal Modeling Engineer

About the role

AheadComputing is hiring a SoC Power and Thermal Modeling Engineer in Austin, Texas or Portland, Oregon. The role builds product-level power and thermal models that project real behaviour from component-level inputs, and feeds power numbers to architecture trade-off studies.

Key responsibilities

• Develop and maintain product-level power and thermal models that project real behaviour from component-level inputs.
• Model power delivery network behaviour, supply droop, di/dt, leakage and thermal limits, and express them as sustainable rather than peak values.
• Set and hold TDP envelopes, typical and peak operating points, and all-core sustained frequency targets.
• Run workload-driven power analysis using representative benchmarks and workload traces.
• Produce sensitivity studies showing which architectural levers move power and by how much.
• Correlate projections against measured silicon and feed errors back into model fidelity.
• Supply power numbers to architecture trade-off studies and build the tooling, assumptions and documentation so the models are usable by others.

Required profile

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science or a related field.
• 5+ years in power modelling, power and thermal analysis or a closely related discipline.
• Demonstrated experience building models from component-level data and defending the results.
• Clear written communication, since the models are used by people who need to understand their limits.

Required skills

• Working understanding of power and thermal fundamentals: dynamic and leakage power, supply droop, di/dt, thermal limits.
• Proficiency in Python for modelling, data analysis and automation.
• Preferred: SoC/CPU power estimation methodology, RTL-based power analysis, power delivery network modelling, DVFS and voltage-frequency curve modelling, thermal modelling, high-performance or server-class CPU experience, and familiarity with advanced TSMC nodes.

What we offer

• Ownership of the power and thermal envelope for every product projection.
• Competitive compensation and benefits package.
• Collaboration with engineers working on cutting-edge CPU technologies.
• Professional growth opportunities in a fast-paced environment.
• A flexible and inclusive work culture.