Lead Systems Signal Integrity / Power Integrity Engineer

About the role

Cerebras Systems builds the world's largest AI chip, which delivers training and inference speeds over 10 times faster than GPU-based cloud services. It is seeking an experienced Lead Systems Signal Integrity and Power Integrity Engineer to solve complex, high-impact integrity challenges in next-generation AI compute systems. The role focuses on deep technical analysis and hands-on problem solving across high-speed interfaces, power delivery networks, rigid and flex interconnects and advanced packaging.

Key responsibilities

• Solve complex signal integrity and power integrity problems for high-speed AI compute platforms, including chip-to-chip and chip-to-board interfaces.
• Perform advanced pre-layout and post-layout SI/PI analysis across PCBs, flex circuits, rigid-flex assemblies, connectors and advanced packages.
• Lead root-cause analysis of issues such as margin shortfalls, impedance discontinuities, coupling, resonances and simulation-to-hardware mismatches.
• Analyze flex circuits, high-speed flex connectors, interposers and advanced packaging technologies.
• Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation.
• Define and refine PCB, rigid-flex and flex circuit stack-ups, material selections and impedance structures.
• Review schematics, PCB layouts and flex designs to identify SI/PI risks and recommend design changes.
• Work with silicon and package design teams on bump/ball assignments, package-to-PCB transitions and interface interactions.
• Act as a technical escalation point for complex SI/PI issues across multiple programs.

Required profile

• Master's degree in Electrical Engineering.
• 15+ years of demonstrated expertise in system-level signal integrity and power integrity engineering for high-speed hardware systems.
• Experience working on server hardware, AI accelerators, datacenter, GPU, CPU, TPU and server platforms; large-scale AI or high-performance compute experience preferred.

Required skills

• High-speed serial and parallel interface analysis and debug.
• PCB, rigid-flex and flex circuit stack-up design and analysis.
• Advanced SI/PI analysis of flex connectors, high-density interconnects and advanced packaging.
• Proficiency with 2D and 3D electromagnetic simulation tools.
• Power delivery network analysis, simulation and lab correlation.
• Transmission line theory, microwave engineering and high-speed design fundamentals.

The base salary range is $220,000 to $250,000+ per year, with possible bonus and equity depending on experience, skills and qualifications. The position is based in Sunnyvale, CA.