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Semi Packaging Engineer

Analog Devices · San José

New
🇬🇧 English
Failure Mode and Effects Analysis (FMEA) Design of Experiments (DOE) Process Control Plans Project Management

Job description

About the role

Analog Devices is seeking a Semi Packaging Engineer to lead new product package development from concept through qualification and production release. You will work closely with design teams, overseas assembly partners, and cross‑functional groups to deliver innovative packaging solutions.

Key responsibilities

  • Drive New Product Introduction (NPI) for semiconductor packages, including design, qualification, and hand‑off to production.
  • Collaborate with business units to capture package requirements and influence design decisions.
  • Coordinate with overseas assembly subcontractors/OSATs, handling conference calls and travel as needed.
  • Partner with reliability, supply‑chain, and other teams to provide package‑related engineering support.
  • Manage project timelines to ensure on‑time delivery of development milestones.
  • Select bill‑of‑materials (BOM) based on mechanical, thermal, and electrical properties of semiconductors, metals, ceramics, and polymers.
  • Develop and enforce package design rules and specifications for module assembly.
  • Create package models and technical drawings for simulation and documentation.
  • Develop assembly processes, control plans, and perform FMEA, DOE, and PCN activities.
  • Conduct finite element analysis (thermal, stress, electrical) as needed.

Required profile

  • Master’s degree in Mechanical, Materials, Chemical, Applied Physics, or Electrical Engineering.
  • 1‑5 years of industrial experience in semiconductor packaging or related fields.
  • Strong knowledge of packaging technologies, process flows, material qualification, and manufacturing implementation.
  • Understanding of IC package reliability, failure analysis techniques, and assembly process issues.

Required skills

  • Finite Element Analysis (FEA)
  • Failure Mode and Effects Analysis (FMEA)
  • Design of Experiments (DOE)
  • Process Control Plans
  • Package Modeling (CAD)
  • Technical Drawing Creation
  • Material Selection
  • Thermal Analysis
  • Stress Analysis
  • Electrical Analysis
  • Project Management

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Published 3 hours ago

Expires 1 month from now

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Analog Devices

San José