Technical Project/Program Management Director – Advanced Packaging

About the role

Lead the development and delivery of advanced packaging programs that enable next‑generation semiconductor and display technologies. You will oversee the full lifecycle from concept through implementation, aligning resources, budgets, and schedules to meet customer and internal roadmap objectives.

Key responsibilities

• Define program scope, objectives, and schedules based on customer requirements and internal technology roadmaps.
• Manage long‑range schedules, task details, and capital allocation using project‑management tools, reports, and tracking charts.
• Coordinate cross‑functional and external teams to ensure on‑time, on‑budget delivery of advanced packaging capabilities.
• Provide technical and operational leadership, resolve integration challenges, and drive readiness for system‑level performance.

Required profile

• Master's degree in Engineering, Materials Science, or a related field.
• 10+ years of experience leading complex, cross‑functional programs in advanced packaging or semiconductor manufacturing.
• Proven ability to influence senior leadership, manage multi‑disciplinary teams, and align programs with business strategy.

Required skills

• Project management tools (scheduling software, tracking charts, checklists).
• Advanced packaging technologies and interconnect scaling expertise.

What we offer

• Competitive annual salary range of $172,000 – $237,000.
• Comprehensive benefits, bonus and stock award programs, and a supportive culture that encourages continuous learning and growth.