Technical Program Management Director

About the role

Applied Materials seeks a senior leader to orchestrate large, complex semiconductor module programs across Logic and Memory business units and key strategic customers. The role blends deep technical knowledge of process technologies with business acumen and executive communication to drive programs from concept to high‑volume manufacturing.

Key responsibilities

• Own end‑to‑end program management for strategic customer engagements, including technology review meetings, yield improvement task forces, and cost‑reduction initiatives.
• Prepare and present executive‑level materials for meetings with customer VPs, CTOs, EVPs, and internal senior leadership.
• Drive alignment across multiple business units, integrated development teams, and cross‑functional teams through structured review cadences.
• Coordinate program execution across US headquarters and international sites (Korea, Japan, Taiwan), managing time‑zone and cultural differences.
• Identify, assess, and retire program risks; lead trade‑off assessments and critical‑path analysis.
• Maintain disciplined program cadence with detailed minutes, action tracking, milestone reporting, and executive status updates.
• Partner with business development to shape new module opportunities and align demo priorities with business objectives.

Required profile

• BS/MS in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field; PhD preferred.
• 12+ years in the semiconductor industry with at least 5 years in technical program management or engineering leadership.
• Strong working knowledge of advanced semiconductor process technologies (DRAM, Logic/Foundry nodes, BEOL, FEOL, etch, deposition, module integration).
• Proven experience managing programs directly with major semiconductor manufacturers at VP/Director level.
• Demonstrated ability to manage large, multi‑workstream programs with rigorous schedule, budget, and risk discipline.
• Exceptional written and verbal communication skills for executive summaries and presentations.

Required skills

• DRAM process technology
• Logic/Foundry node technologies
• BEOL integration
• FEOL device engineering
• Etch and deposition processes
• Module integration expertise
• Program management tools (e.g., Accolade/PDBoK)

What we offer

• Salary range: $172,000 – $237,000 per year.
• Supportive work culture encouraging learning, development, and career growth.
• Comprehensive health, wellbeing, and employee assistance programs.
• Eligibility for bonus and stock award programs.