Senior Process Engineer – Semiconductor Packaging

About the role

Mesh Optical Technologies is building high‑volume semiconductor‑grade packaging processes for advanced photonic products. We are looking for a Senior Process Engineer to lead the development, qualification, and transfer of wafer‑prep and die‑level packaging processes from R&D to full production.

Key responsibilities

• Develop and own wafer preparation and die‑level processes such as bumping, dicing, sub‑micron precision bonding, optical alignment, flip‑chip and wire bonding, dispensing, and fully automated final assembly.
• Select tools and materials, create recipes, and define statistical process control limits for volume production.
• Translate package and product designs into manufacturable processes and collaborate with electrical, mechanical, and photonic design teams.
• Design processes from lab bench through proof‑of‑concept to production ramp, establishing design‑for‑manufacturing rules.
• Characterize parts using x‑ray, FIB/SEM, CSAM, and die shear testing, and close the loop with cross‑functional teams.
• Lead failure‑analysis, root‑cause investigations, and corrective actions to push yields above 99.9% and ensure long‑term reliability.
• Provide technical mentorship to build a high‑volume semiconductor packaging capability in the US.

Required profile

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or a related field.
• At least 2 years of hands‑on semiconductor process‑development experience, preferably with 5+ years of fab or wafer‑level packaging work.
• Strong troubleshooting ability in cleanroom or controlled manufacturing environments.
• Willingness to work extended hours and weekends when needed.

Required skills

• Wafer preparation, bumping, dicing, sub‑micron precision bonding, optical alignment.
• Flip‑chip bonding, wire‑bonding, dispensing, automated assembly.
• Tool and material selection, recipe development, statistical process control.
• X‑ray inspection, FIB/SEM analysis, CSAM, die shear testing.
• Failure analysis, root‑cause analysis, corrective‑action implementation.
• Statistical quality control, process improvement, internal audits.
• Cleanroom operations, lithography, etching, CVD, CMP, solder bumping.