Senior Hybrid Bonding Module Engineer

About the role

We are seeking a highly motivated Die-to-Wafer Hybrid Bonding Module Engineer to develop and scale next‑generation hybrid bonding technologies for advanced semiconductor packaging applications such as memory, chiplets, AI accelerators, photonics and heterogeneous integration platforms.

Key responsibilities

• Develop and optimize die‑to‑wafer hybrid bonding processes, establishing process windows for surface preparation, plasma activation, die placement, bonding temperature/pressure and post‑bond annealing.
• Support integration of hybrid bonding into memory architectures, chiplet‑based systems, silicon interposers, system‑on‑wafer platforms and co‑packaged optics.
• Identify root causes of bond voids, die shift, overlay errors, particle contamination and drive yield improvement using DOE and statistical process control.
• Characterize bonding quality with CSAM X‑ray inspection, FIB/SEM, AFM, optical metrology and electrical test structures.
• Collaborate with equipment engineering teams on hybrid bonding systems, die placement tools and plasma activation modules.
• Define and execute reliability test plans, including thermal cycling, HTOL, mechanical pull/shear and moisture sensitivity.
• Lead cross‑functional projects, publish technical results and mentor junior engineers.

Required profile

• M.S. in Materials Science, Electrical/Mechanical/Chemical Engineering, Physics or Semiconductor Manufacturing (or Ph.D. in one of these fields).
• Minimum 5 + years semiconductor process development experience after graduate degree.
• Direct experience with hybrid bonding, thermocompression bonding, wafer bonding or advanced packaging.
• Strong problem‑solving skills and ability to drive technology from R&D to manufacturing.

Required skills

• Hybrid bonding and thermocompression bonding
• Wafer bonding and advanced packaging
• HBM and 3D stacking technologies
• Cu‑Cu interconnect formation and dielectric‑dielectric bonding
• DOE, JMP/Minitab statistical analysis
• CSAM X‑ray, FIB/SEM, AFM, optical metrology
• Electrical test structures and reliability testing

What we offer

• Salary range $147,000 – $202,500 per year
• Full‑time permanent position in Santa Clara, CA
• Supportive work culture with opportunities for learning, development and career growth
• Comprehensive benefits package, bonus and stock award programs