Senior Device Integration & Innovation Engineer – Logic/Memory

About the role

Applied Materials is seeking a senior engineer to lead integration of advanced logic and memory technologies. The role combines technical leadership, innovative technology development, and close collaboration with customers and internal teams.

Key responsibilities

• Lead integration for FEOL, MEOL and BEOL projects targeting advanced logic and memory devices.
• Provide technical leadership for module development across channels, junctions, gates, contacts, interconnects, NAND and DRAM.
• Design and implement new integrated‑materials technologies and execute process‑engineering projects.
• Resolve high‑value, complex process‑engineering issues for key customers and business units.
• Generate technical documentation, presentations, specifications and reports for new products.
• Drive R&D of novel technologies, often serving as primary inventor on patents and publications.

Required profile

• Bachelor’s degree with 10‑15 years of relevant experience in semiconductor device integration.
• Recognized thought leader and integration expert influencing strategy and leading multidisciplinary projects.
• Strong leadership, problem‑solving and communication skills, able to persuade senior stakeholders.

Required skills

• CMOS logic transistor formation
• FEOL, MEOL, BEOL process knowledge
• Process engineering and hardware characterization
• Film property measurement

What we offer

• Salary range $163,000 – $224,000 per year
• Supportive work culture with opportunities for growth, bonus and stock awards
• Comprehensive health, wellbeing and professional development programs