Process Engineer II – Advanced Packaging

Key responsibilities

• Assist with automation wet process demonstrations, including tool preparation, wafer processing, measurement, chemical analysis, and documentation.
• Assist with high‑volume manufacturing tool set‑up and process optimization of wet processes.
• Lead chemical analysis tool set‑up involving chemical analysis and testing.
• Conduct electrochemical testing/analysis to investigate impacts on wet‑process results.
• Assist with root‑cause analysis and deep‑dive failure analysis.
• Support high‑volume manufacturing tool set‑up, failure analysis and reliability testing.

Qualifications

• Master’s degree in Materials Science, Materials Engineering, Chemical Engineering, Electrical Engineering or a related field.
• Chemistry engineering experience related to plating processes and chemical analysis (preferred).
• Experience in semiconductor processing or manufacturing (preferred).
• Experience in advanced packaging processing (preferred).
• Experience with chemical analysis tools and metrology equipment such as AOI, AOS, CSAM, 3D X‑ray CT (preferred).
• Knowledge of process control and Statistical Process Control (SPC) methodologies.
• Proficiency with thin‑film characterization techniques (SEM, TEM, XRD, XPS, SIMS, etc.).
• Ability to independently drive projects and deliver a product.

What we offer

• Salary range: $100,000 – $136,500 per year.
• Location: Santa Clara, CA.
• Comprehensive benefits package, including health, wellbeing, bonus and stock award programs.
• Supportive work culture with learning and development opportunities.
• Eligibility for relocation assistance and travel (approximately 10% of time).