Process Engineer – Die to Wafer Hybrid Bonding

About the role

Applied Materials is hiring a Process Engineer in its Santa Clara headquarters to drive die-to-wafer (D2W) hybrid bonding R&D within the Photonics Platforms Business Group. The role covers hybrid bonding process development, pathfinding, technology de-risking and advanced packaging integration, with on-the-job training and hands-on experience with state-of-the-art equipment, including the industry's first fully integrated die-to-wafer hybrid bonding system.

Key responsibilities

• Develop die-to-wafer hybrid bonding processes, including surface preparation and plasma activation, high-accuracy die placement and alignment, and post-bond characterization and process evaluation.
• Integrate D2W bonding with adjacent process modules such as dicing and die preparation, die thinning, inter-die gap fill and planarization.
• Design and run DOE-driven experiments to understand process limits, sensitivities and trade-offs.
• Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.

Required profile

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics or a related STEM discipline.
• Hands-on experience in die-to-wafer or wafer-to-wafer hybrid bonding, thin die handling and alignment, micro-LED or CPO, heterogeneous integration (e.g. III-V to Si) and 2.5D/3D integration.
• Experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment).
• Understanding of bond interface physics, alignment and overlay fundamentals, and mechanical behavior of thin, fragile dies.
• Self-starter with strong problem-solving skills, able to work independently and collaboratively with minimal supervision.

Required skills

• Statistical analysis and process control, including DOE, SPC and JMP.
• Strong communication and interpersonal skills across multidisciplinary teams.

What we offer

• Salary of $147,000 to $202,500.
• Full-time position with relocation eligibility and travel of about 10% of the time.
• A comprehensive benefits package, with possible bonus and stock award program participation.