Mechanical Engineering Manager (PVD Modules)

About the role

Applied Materials is looking for a Mechanical Engineering Manager (E5) in Santa Clara, CA, to lead a team of mechanical engineers responsible for developing and sustaining advanced PVD modules and subsystems. The role combines people leadership, technical strategy, execution ownership and deep semiconductor equipment expertise, covering vacuum, RF, thermal, process-facing and precision mechanical assemblies.

Key responsibilities

• Lead and develop a team of mechanical engineers across NPI, sustaining and customer programs.
• Own the mechanical execution of PVD chamber, pedestal, ESC, process kit, wafer handling and vacuum hardware developments.
• Drive architecture decisions balancing performance, manufacturability, cost, reliability and serviceability.
• Partner with process, systems, electrical, manufacturing, quality and supplier teams.
• Lead root-cause investigations for field, manufacturing and customer issues.
• Manage schedules, resource planning, risk management and engineering priorities.
• Develop supplier capability and qualification strategies.
• Coach engineers on GD&T, tolerance analysis, FEA, thermal analysis and design reviews.

Required profile

• BS/MS in Mechanical Engineering or a related discipline.
• 10+ years of semiconductor equipment experience, with 2+ years of technical leadership or people management experience.
• Strong mechanical design background in vacuum systems, RF hardware, thermal management and precision assemblies.
• Experience leading multidisciplinary development programs from concept through customer release.
• Excellent communication and stakeholder management skills.

Preferred qualifications

• Deep PVD experience including process chamber hardware, cathodes, shields, deposition sources, ESCs, pedestals and process kits.
• Experience with advanced packaging, logic or memory applications.
• Knowledge of plasma-material interactions, contamination control, vacuum technology and thermal management.
• Experience with global engineering teams and major semiconductor customers.

What we offer

• Salary of $163,000 to $224,000.
• A comprehensive benefits package, with possible eligibility for a bonus and a stock award program.
• Travel of up to 10% of the time; relocation is not eligible.