Mechanical Engineering Manager

About the role

The Mechanical Engineering Manager (E5) leads a team of engineers developing and sustaining advanced PVD modules and subsystems for semiconductor equipment. This role blends people leadership, technical strategy, and deep hardware expertise to drive new product introduction, cost reduction, reliability improvements, and roadmap development.

Key responsibilities

• Lead and develop a team of mechanical engineers across NPI, sustaining, and customer programs.
• Own mechanical execution of PVD chamber, pedestal, ESC, process kit, wafer handling and vacuum hardware developments.
• Drive architecture decisions balancing performance, manufacturability, cost, reliability and serviceability.
• Partner with process, systems, electrical, manufacturing, quality and supplier teams.
• Lead root‑cause investigations for field, manufacturing and customer issues.
• Manage schedules, resource planning, risk management and engineering priorities.
• Develop supplier capability and qualification strategies.
• Coach engineers on GD&T, tolerance analysis, FEA, thermal analysis and design reviews.

Required profile

• BS/MS in Mechanical Engineering or related discipline.
• 10+ years semiconductor equipment experience with at least 2 years in technical leadership or people management.
• Strong mechanical design background in vacuum systems, RF hardware, thermal management and precision assemblies.
• Proven experience leading multidisciplinary development programs from concept through customer release.
• Excellent communication and stakeholder management skills.

Required skills

• Mechanical design
• Vacuum systems
• RF hardware
• Thermal management
• Precision assemblies
• GD&T and tolerance analysis
• Finite Element Analysis (FEA) and CFD
• NX and Teamcenter

What we offer

• Salary range $163,000 – $224,000 per year.
• Supportive work culture that encourages learning, development and career growth.
• Comprehensive health, wellbeing and benefits programs.
• Opportunities to work on cutting‑edge semiconductor equipment advancing AI and next‑generation chips.