Lead Engineer - Electronics & Mechanical Packaging

About the role

The Lead Engineer sits in the Electronics Hardware team and is responsible for the mechanical design of power and control electronic products used in locomotives and surface mining trucks. The Packaging Engineer works with a cross-functional team to integrate circuit card assemblies, discrete components and interconnect devices into a mechanical enclosure that meets the physical, performance, thermal and environmental requirements of the project. The role also covers thermal analysis, stress analysis, validation testing and manufacturing support.

Key responsibilities

• Design and model complex electronic assemblies with PCBs and interconnects integrated into a mechanical enclosure, working with electrical and system engineers
• Design electronic enclosures and optimize panel architecture for performance, testability, manufacturability and cost
• Select connector and interconnect devices based on project requirements and vendor options
• Apply ruggedized electronics best practices, including thermal management, EMC, shock and vibration
• Create finite element models and perform thermal simulations, including tradeoff studies of active and forced air cooling
• Analyze mechanical assembly characteristics such as bolted joints, tolerance stack-ups and GD&T
• Prepare and release design documentation (drawings, calculations, bills of material, purchase specifications)
• Run design reviews, support vendor selection, production launch and PPAP documentation
• Lead validation and qualification of new products, components and assemblies, and resolve technical issues

Required profile

• Bachelor's degree in Mechanical Engineering; Master's preferred
• Minimum of 3 years of experience in mechanical packaging design for electronic control and power supply assemblies
• Proven experience launching electronic products into production, including DFM, DFT and DTC, with familiarity in high-voltage power supply and inverter packaging
• Willingness to travel up to 10%

Required skills

• Strong proficiency in 3D CAD (Siemens NX/Unigraphics preferred) and stress and thermal simulation tools (ANSYS, Icepak, CFD)
• Knowledge of rigid, flexible and rigid-flex PCB integration, electrical connectors, interconnects and EMC design
• Solid understanding of material properties, sheet metal design, welding methods and thermal management

What we offer

• Salary range of $62,100-$85,300, depending on experience, education and location
• Health, welfare and retirement benefits
• Possible relocation assistance and annual bonus if eligible