CMP Module Process Engineer IV

About the role

Applied Materials, a global leader in materials science and semiconductor equipment, is seeking a CMP Module Process Engineer IV to drive advanced Chemical Mechanical Planarization (CMP) solutions for its wafer fab customers. The role requires a technical expert with over ten years of CMP experience and strong data‑analytics capabilities to solve complex process and yield challenges.

Key responsibilities

• Lead technical discussions with customers to understand high‑value problems, propose and implement continuous‑improvement projects, and capture learnings to improve key performance indicators.
• Analyze CMP process data, identify root causes of defects or variability, and execute corrective actions to enhance yield and integration.
• Drive adoption of FabVantage service technologies through demos, on‑site evaluations, and joint development programs.
• Mentor junior process engineers and contribute to the CMP network of experts and community of practice.

Required profile

• Bachelor’s degree in Engineering.
• 10+ years of experience in Chemical Mechanical Planarization (CMP) within a wafer fab environment.
• Proven ability to communicate complex technical ideas to senior stakeholders and influence decisions.
• Recognized as a technical expert in CMP unit processes and wafer fab operations.

Required skills

• Chemical Mechanical Planarization (CMP) process expertise.
• Data analytics for process and yield troubleshooting.
• Defect analysis and statistical process control (Cpk) implementation.
• FabVantage service platform knowledge.
• Wafer fab equipment operation and integration.

What we offer

• Competitive salary range of $116,000 – $159,500 per year.
• Work locations in Boise, Dallas, Hillsboro, Phoenix, and Santa Clara.
• Supportive culture with health, wellbeing, and professional development programs.