Capital Equipment Hardware Engineer - Advanced Packaging

About the role

Applied Materials is looking for a Global Product Support (GPS) Engineer (Capital Equipment Hardware Engineer) in Santa Clara, CA, to support the installation, startup, qualification and ongoing operation of the Kinex Hybrid Bonding platform for its CTO advanced packaging development programs. The engineer is the primary equipment support person, working with Facilities, BESI, product engineering and CTO process development teams.

Key responsibilities

• Support Kinex installation from tool dock through release to engineering users, coordinate Tier 0, 1 and 2 startups, close installation punch-list items and support factory and site acceptance with vendors
• Develop Facility Data Sheet updates, define and validate tool utility requirements, and support hookup and qualification
• Troubleshoot mechanical, electrical, automation and process issues, develop preventive maintenance procedures, analyze performance trends, run root cause investigations and drive corrective actions
• Act as technical interface with BESI and Kinex product engineering, manage escalations, service activities, upgrades and engineering changes
• Support hybrid bonding process development, wafer-to-wafer and die-to-wafer bonding, and new module integration and experimental hardware evaluations

Required profile

• BS in Mechanical, Electrical, Mechatronics, Systems Engineering or a related discipline
• 3-7 years of engineering experience in semiconductor equipment; new college graduates will not be considered
• Experience supporting semiconductor manufacturing or development equipment
• Strong troubleshooting and root-cause analysis skills, and excellent verbal and written communication

Required skills

• Preferred: experience with advanced packaging equipment, hybrid bonding, wafer bonding, die attach, packaging or assembly systems, wet clean processes, equipment installation and startup, facilities hookup, vendor management and complex equipment troubleshooting
• Preferred knowledge: automated material handling, vacuum, plasma processing, wet processing, metrology systems, site prep documentation, equipment specifications, startup plans and qualification procedures
• Bonus: prior BESI equipment experience, hybrid bonding process knowledge, 300 mm equipment experience, project management experience, cleanroom construction or tool installation experience

What we offer

• Salary of $124,000 - $171,000
• Full-time position, travel about 10% of the time, relocation eligible
• Possible bonus and stock award program participation