Capital Equipment Hardware Engineer – Advanced Packaging

About the role

Applied Materials seeks a Global Product Support Engineer to lead installation, startup, qualification and ongoing operation of the Kinex™ Hybrid Bonding platform for advanced packaging development programs.

Key responsibilities

• Install and start up the Kinex Hybrid Bonding platform from tool dock through release to engineering users.
• Coordinate Tier 0, Tier 1 and Tier 2 startup activities and resolve installation punch‑list items.
• Develop and maintain Facility Data Sheets, define utility requirements and support hookup and qualification.
• Troubleshoot mechanical, electrical, automation and process issues; create preventive maintenance procedures.
• Analyze equipment performance, drive root‑cause investigations and implement corrective actions.
• Act as primary technical interface with BESI and Kinex product engineering, managing escalations and engineering changes.
• Support advanced packaging development, enabling wafer‑to‑wafer and die‑to‑wafer hybrid bonding projects.

Required profile

• Bachelor’s degree in Mechanical, Electrical, Mechatronics, Systems Engineering or related field.
• 3–7 years of engineering experience with semiconductor equipment (new graduates not considered).
• Experience supporting semiconductor manufacturing or development equipment with strong troubleshooting and root‑cause analysis skills.
• Excellent verbal and written communication and ability to work across facilities, vendors, process engineering and operations teams.

Required skills

• Hybrid bonding, wafer bonding, die‑attach and advanced packaging equipment.
• Wet clean processes and systems.
• Equipment installation, startup and qualification procedures.
• Facilities utility integration and hookup.
• Vendor management and supplier coordination.
• Automated material handling, vacuum, plasma processing and metrology systems.

What we offer

• Salary range $124,000 – $171,000 per year.
• Supportive work culture with opportunities for learning, development and career growth.
• Health, wellbeing and employee assistance programs.
• Access to global resources and cutting‑edge semiconductor technology.