Campus Package Architect - Data Center Silicon

About the role

MediaTek's Data Center Product Architecture and Technology team is looking for a recent graduate to join its campus program in San Jose, California (on-site) or Portland, Oregon (on-site). The role develops packaging solutions for next-generation data center and AI silicon products, within a fast-growing team focused on cloud infrastructure and AI.

Key responsibilities

• Develop and evaluate packaging solutions for next generation data center and AI silicon products.
• Perform signal and power integrity analysis for high-speed interfaces, and design and analyze power delivery networks for next-generation XPUs.
• Collaborate with cross-functional teams to improve packaging solutions in key areas such as performance and form factor.
• Stay informed about industry and technology trends.

Required profile

• Student graduating after December 2026 or in 2027 with a Master's degree or higher in Electrical Engineering or a related field in Physics.
• Solid understanding of VLSI package design and silicon interactions, and of silicon packaging and deep submicron processes.
• Able to take responsibility for a variety of technical tasks and work independently.

Required skills

• Transient and frequency domain analysis experience.
• Proficiency with package layout tools (e.g., Cadence Allegro) and SI/PI tools (e.g., Ansys HFSS).

What we offer

• Salary range of $122,000-$213,000, with possible performance bonus and short- and long-term incentive programs depending on skills and qualifications.
• Health, life and disability insurance, savings plan, company-paid holidays, sick leave, vacation time, parental leave, 401K and more.