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Applications Engineer – Semiconductor 3D X-ray Solutions

amat · Benicia

New
Senior 108,000 - 148,500 USD/year 🇬🇧 English
SEM FIB microscopy optical fundamentals semiconductor inspection metrology failure analysis 3D IC heterogeneous integration advanced packaging data acquisition analysis workflows

Job description

About the role

As an Applications Engineer you will join Applied Materials' team focused on advancing 3D X‑ray solutions for semiconductor inspection, metrology and failure analysis. You will work closely with fab customers, FA labs and R&D centers to deliver cutting‑edge workflows and technical support.

Key responsibilities

  • Lead system demonstrations and technical reviews for semiconductor customers, including fabs and research facilities.
  • Develop new application methodologies tailored to advanced packaging, 3D IC and heterogeneous integration.
  • Provide critical input to product development by translating customer needs into system specifications.
  • Deliver advanced training on system operation, data acquisition and analysis workflows.
  • Perform tool characterization, benchmarking and baseline performance studies for semiconductor use cases.
  • Represent the company at industry conferences, trade shows and in technical publications.

Required profile

  • BS or MS in Materials Science, Physics, Electrical Engineering or a related field.
  • 3–5 years of experience in semiconductor fabs, failure analysis, metrology or process development.
  • Hands‑on experience designing experiments, analyzing data and delivering results in a customer‑facing environment.
  • Willingness to travel up to 30% domestically and internationally.

Required skills

  • Microscopy and advanced imaging techniques (X‑ray CT, SEM, FIB).
  • Understanding of X‑ray absorption principles and optical fundamentals.
  • Experience with semiconductor capital equipment for inspection, metrology or failure analysis.
  • Knowledge of advanced semiconductor technologies such as 3D IC, heterogeneous integration and advanced packaging.
  • Data acquisition, analysis workflows and tool benchmarking.
  • Experiment design and statistical data analysis.

What we offer

  • Competitive salary range of $108,000 – $148,500 per year.
  • Supportive on‑site work culture with opportunities for professional growth.
  • Comprehensive benefits package, including health, wellness and stock award programs.

Questions fréquentes

Le salaire proposé pour ce poste est de 108-149k USD par an. Le détail figure dans l'annonce.
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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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amat

Benicia