Advanced Packaging Process Engineer III (E3)

About the role

Applied Materials, a global leader in materials science and engineering solutions for semiconductors and advanced displays, is hiring an Advanced Packaging Process Engineer III in Santa Clara, California. The role involves designing and analyzing difficult process engineering experiments, characterizing hardware and working closely with customers and vendors.

Key responsibilities

• Design, collect data, analyze and compile reports on difficult process engineering experiments
• Perform hardware characterization on a variety of difficult systems
• Troubleshoot complex problems, perform root cause analysis and resolve process engineering issues
• Measure film properties and interpret data
• Generate internal documentation for products, presentations and technical reports
• Engage with customers to resolve complex process engineering issues or concerns, under limited supervision
• Identify, select and partner with vendors and suppliers
• Implement new technology, products and analytical instrumentation
• Serve as a resource for junior colleagues and lead project teams as needed

Required profile

• BS or MS degree in Electrical, Chemical or Mechanical Engineering, Materials Science, Physics or a related field
• 4-7 years of related experience
• Conceptual and practical expertise in complex problem solving
• Experience with electronic packaging fabrication such as W2W and D2W bonding
• Previous hands-on experience with tool operation and process development in the PCB or semiconductor industry

What we offer

• Salary of $124,000 to $171,000, depending on location, hire grade, knowledge, skills, experience and internal equity
• Additional compensation such as a bonus and a stock award program may be available
• Full-time position, with travel of up to 10% of the time and relocation eligibility