Advanced Packaging Integration Engineer

About the role

Applied Materials is seeking an Advanced Packaging Integration Engineer to lead process integration for high‑performance interconnects and micro‑LED panels within its Photonics Platform Business Group in Santa Clara. The role involves designing robust, scalable integration flows and collaborating with fabs, assembly houses, and cross‑functional teams to deliver production‑ready solutions.

Key responsibilities

• Define, develop, execute, and optimize advanced packaging process integration flows such as hybrid bonding and 2.5D/3D heterogeneous integration.
• Own and manage complex technical projects, tracking progress and resolving roadblocks to ensure on‑time, high‑quality delivery.
• Design experiments, collect and analyze data, conduct root‑cause analysis, and implement corrective actions.
• Collaborate with foundries, OSATs, and internal research teams to improve integration strategies and stay current with field advancements.

Required profile

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
• Hands‑on experience with advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, TSV, RDL, underfill, bumping, molding, and OSAT processes.
• Strong communication and interpersonal skills for effective multidisciplinary collaboration.

Required skills

• Hybrid bonding, wafer‑to‑wafer and die‑to‑wafer integration
• 2.5D/3D heterogeneous integration, TSV, RDL, underfill, bumping, molding
• Micro‑LED or CPO technology (plus)
• Statistical data analysis, Design of Experiments, SPC, JMP
• Coding (any language) and MES system familiarity (plus)
• Executive‑level presentation preparation (plus)

What we offer

• Salary range $161,000 – $221,000 per year
• Supportive work culture with health, wellbeing, and professional growth programs