Process Engineer II – Office of the CTO

About the role

As a Process Engineer in the Office of the CTO, you will design and optimize manufacturing processes for advanced semiconductor packaging and display technologies. You will conduct lab experiments, analyze data, and collaborate with cross‑functional teams to drive innovation.

Key responsibilities

• Conduct lab‑based experiments to evaluate and improve advanced packaging processes.
• Develop, optimize, and sustain photolithography processes for advanced packaging.
• Design experiments, collect data, analyze results, and compile technical reports.
• Perform hardware characterization and troubleshoot complex engineering issues.
• Generate internal and external documentation, including presentations and technical reports.
• Interact with customers to resolve process engineering problems.
• Measure film properties and interpret data.
• Identify, select, and work with vendors and suppliers.
• Implement new technologies, products, and analytical instrumentation.

Required profile

• Hands‑on experience in semiconductor packaging or fabrication, preferably in lithography.
• Expertise in photolithography, wet chemical etch/clean, and dry film lamination.
• Ability to conduct root‑cause analysis and solve complex process issues.
• Experience collaborating with vendors, suppliers, and R&D teams.

Required skills

• Lithography
• Photolithography
• Wet chemical etch/clean
• Dry film lamination
• Hardware characterization
• Data analysis
• Film property measurement
• Semiconductor packaging
• Advanced packaging processes (wafer‑level packaging, flip‑chip, 3D integration)

What we offer

• Salary range $100,000 – $136,500 per year.
• Full‑time onsite position in Santa Clara, CA.
• Supportive work culture with opportunities for professional growth.
• Comprehensive benefits program focused on health, wellbeing, and work‑life balance.