Process Engineer II - Advanced Packaging

About the role

Applied Materials is hiring a Process Engineer II for its Office of the CTO in Santa Clara, California. The engineer develops, optimizes and maintains laboratory-scale processes for semiconductor advanced packaging, working with R&D teams on projects such as wafer-level packaging, flip-chip and 3D integration. The position is full-time and on-site.

Key responsibilities

• Conduct lab-based experiments to evaluate and improve advanced packaging processes.
• Develop, optimize and sustain photolithography processes for advanced packaging.
• Design experiments, collect and analyze data, and write reports on difficult process engineering experiments within safety guidelines.
• Perform hardware characterization on complex systems within safety guidelines.
• Troubleshoot complex problems, perform root cause analysis and resolve process engineering issues.
• Generate internal and external documentation for products, presentations and technical reports.
• Interact with customers to resolve process engineering issues with limited supervision.
• Measure film properties and interpret data.
• Identify and work with vendors and suppliers, and implement new technology, products and analytical instrumentation.

Required profile

• Hands-on semiconductor packaging and/or semiconductor fabrication experience in academia and/or industry.
• Background in lithography process engineering preferred, with hands-on experience in semiconductor lithography.
• Ability to work independently with limited supervision and to act as a resource for colleagues with less experience.

Required skills

• Lithography process expertise preferred.
• Wet chemical etch/clean and dry film lamination expertise preferred.

What we offer

• Salary of $100,000 to $136,500.
• Comprehensive benefits package, with possible eligibility for a bonus and stock award program.
• Relocation eligibility and travel of up to 20% of the time.