Process Engineer – Die to Wafer Hybrid Bonding

About the role

Join the Photonics Platforms Business Group at Applied Materials in Santa Clara to develop cutting‑edge 2.5D/3D advanced packaging technologies. You will work with a cross‑functional research team to drive die‑to‑wafer hybrid bonding R&D, focusing on process development, pathfinding, and technology de‑risking.

Key responsibilities

• Develop die‑to‑wafer hybrid bonding processes, including surface preparation, plasma activation, high‑accuracy die placement, and post‑bond characterization.
• Integrate D2W bonding with adjacent modules such as dicing, die thinning, and inter‑die gap fill.
• Design and execute DOE‑driven experiments to understand process limits and trade‑offs.
• Own process optimization, perform failure analysis, and drive continuous engineering improvement.

Required profile

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• Hands‑on experience with die‑to‑wafer or wafer‑to‑wafer bonding, thin‑die handling, or heterogeneous integration.
• Experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment).
• Strong problem‑solving ability and ability to work independently or collaboratively.

Required skills

• Die‑to‑wafer and wafer‑to‑wafer bonding techniques
• Thin‑die handling and alignment‑critical processes
• Micro‑LED or CPO experience
• Heterogeneous integration (III‑V to Si, novel materials to Si)
• Bond interface physics, alignment and overlay fundamentals
• Statistical analysis and process control (DOE, SPC, JMP)

What we offer

• Salary range $124,000 – $171,000 per year
• Supportive work culture with opportunities for learning, development, and career growth