Focused Ion Beam (FIB) Technician IV

About the role

The Focused Ion Beam (FIB) Technician IV prepares and processes wafer samples for advanced analysis, operates FIB equipment, and supports laboratory workflow in a semiconductor manufacturing environment.

Key responsibilities

• Prepare samples for FIB lamella making, optimize preparation procedures, and identify cutting locations based on pattern instructions.
• Operate FIB equipment, perform software alignment, flash and plasma cleaning, and execute routine shutdown procedures.
• Produce TEM lamellae according to job assignments, selecting patterns of interest and ensuring quality requirements.
• Coordinate instrument repair and maintenance with engineering and service teams.
• Prepare samples from 3D‑NAND, planar view, and gate‑fin structures and evaluate wafers.

Required skills

• Proficiency in operating Focused Ion Beam (FIB) systems.
• Experience with sample preparation for TEM lamellae.
• Knowledge of basic FIB principles and software alignment functions.
• Ability to perform equipment maintenance tasks such as flash and plasma cleaning.
• Familiarity with scanning electron microscope (SEM) analysis and wafer evaluation.

What we offer

• Competitive hourly rate ranging from $33.00 to $45.70.
• Full‑time position in Santa Clara, CA with a supportive work culture.
• Comprehensive benefits package, including health and wellbeing programs, bonus eligibility, and stock awards.
• Opportunities for professional growth and development in a global leader of materials engineering.