Advanced Packaging Process Engineer III

About the role

Applied Materials is a global leader in materials science and engineering solutions that underpin modern semiconductor chips and advanced displays. The Advanced Packaging Process Engineer III will design, execute, and analyze complex process engineering experiments, troubleshoot challenging issues, and collaborate with customers and vendors to drive innovative packaging solutions.

Key responsibilities

• Design, collect data, analyze, and compile reports on difficult process engineering experiments.
• Perform hardware characterization on a variety of difficult systems.
• Troubleshoot complex problems, conduct root‑cause analysis, and resolve challenging process engineering issues.
• Measure film properties, interpret data, and generate internal documentation for products and technical reports.
• Engage with customers to resolve complex process engineering concerns under limited supervision.
• Identify, select, and partner with vendors and suppliers; implement new technology, products, and analytical instrumentation.
• Serve as a resource for junior colleagues and lead project teams as needed.

Required profile

• BS or MS in Electrical, Chemical or Mechanical Engineering, Materials Science, Physics, or a related field.
• 4–7 years of related experience demonstrating conceptual and practical expertise in complex problem solving.
• Experience with electronic packaging fabrication such as W2W and D2W bonding.
• Hands‑on experience with tool operation and process development in the PCB or semiconductor industry.

Required skills

• W2W bonding
• D2W bonding
• Electronic packaging fabrication
• Hardware characterization
• Tool operation
• Process development
• Film property measurement

What we offer

• Salary range: $124,000 – $171,000 per year.
• Location: Santa Clara, CA.