Advanced Packaging Integration Engineer

About the role

Applied Materials' Photonics Platform Business Group in Santa Clara is hiring an Advanced Packaging Integration Engineer. You will lead process integration for high-performance interconnects and micro-LED panels, architecting robust, scalable integration flows that meet manufacturability and reliability requirements. The role works closely with design, process, integration and metrology teams, as well as fabs, assembly houses, suppliers and external partners.

Key responsibilities

• Define, develop, execute and optimize advanced packaging process integration flows (e.g. hybrid bonding, 2.5D/3D heterogeneous integration) to maximize product performance, yield and reliability.
• Own and drive complex technical projects, tracking progress and solving roadblocks to ensure on-time delivery with high quality.
• Design experiments, collect and analyze data, run root-cause analysis and implement corrective actions.
• Work with foundries, OSATs and internal research teams to define and implement improved integration strategies and methodologies.
• Stay abreast of field advancements and apply them to drive innovations.

Required profile

• Ph.D. or M.S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics or a related STEM field.
• In-depth knowledge and hands-on experience in advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding and OSAT processes.
• Strong communication and interpersonal skills, able to collaborate across multidisciplinary teams.
• Self-starter with strong problem-solving skills, able to work independently and in teams with minimal supervision.
• Candidates with varying experience levels are encouraged to apply.

Required skills

• Statistical data analysis and process optimization and control techniques (e.g. Design of Experiments, SPC, JMP).
• Plus: Micro-LED or CPO experience, coding capability, MES system experience, and the ability to present to executives or customers.

What we offer

• Salary of $161,000 to $221,000, depending on location, hire grade, knowledge, skills, experience and internal equity.
• Comprehensive benefits package, with possible eligibility for a bonus and stock award program.
• Full-time position, with travel of about 10% of the time and relocation eligibility.